Panasonic NPM D3 SMT Assembly line

Products description:

Panasonic NPM D3 SMT Assembly line

Industry's first 3D Multi Recognition Camera
Lightweight 16-nozzle head (for 84,000 cph)
Increased placement accuracy to 25um (cpk ≥1.0)

The evolutionary Panasonic NPM-D3 continues in the steps of its award-winning predecessor with interchangeable dispensing, placement, and inspection heads; however, new enhancements further increase productivity. The NPM-D3 now handles a component range spanning 03015mm microchips to massive 100x90mm components up to 28mm tall, as well as Package on Package applications.

1. PCB loader

Micro computer controlled component ensures machine’s stable and reliable running.
Optional Fuji buttons interface or touch panel interface, convenient man-machine interaction.
Multiple sound and light alarming functions
Use standard magazines, good compatibility, load with 3 magazines at one time.
Lifting distance adjustable according to PCB, 4 kinds of distance(10mm, 20mm, 30mm and 40mm)
Loader configured with inner push board component, save the cost of buying PCB moving machine independently.

Automatic counting function make it easy of production statistic
Optional SMEMA port for communication between machines.

2. DEK Neo Horizon SMT Stencil Printer

With its modular design, the latest generation of our powerful screen printers is customizable for any customer-specific or application-specific requirements. Clamping systems, conveyors, tooling, paste management, verification – the DEK NeoHorizon can be equipped and/or retrofitted with many powerful and precision-enhancing options. All this flexibility can be controlled easily and comfortably with the leading printer software: DEK Instinctiv™ V9.
Two basic printer configurations are available: The DEK NeoHorizon 03 iX with the DEK HawkEye 750 camera system, semi-automatic stencil load and the IUSC understencil cleaning system features a core cycle time of 8.0 seconds and a machine accuracy of ±20 µm @ 2 Cmk for use in high-mix environments. The DEK NeoHorizon 01 iX with its core cycle time of 6,5 seconds and enhanced machine accuracy of ±15 µm @ 2 Cmk was designed for applications with particularly high demands on quality and throughput, for example for 0201 (metric) components. This configuration is equipped with the high-resolution DEK HawkEye 1700 camera, a fully automatic stencil alignment system, and the high-end DEK Cyclone understencil cleaning system.

3. Koh Young KY8080 3D SPI.

The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste.
• True patented 3D volume measurement
• No false calls – no escapes – no shadow problems
• Highest accuracy and repeatability
• No PCB color sensitivity
• Solder paste printing optimization - at its best
• Lower initial investment
• Low cost of ownership, fast ROI
• Shortest programming time
• Accurate, powerful SPC tool package

4. Panasonic NPM D3 Pick and Place Machine

Industry's first 3D Multi Recognition Camera

Lightweight 16-nozzle head (for 84,000 cph)
Increased placement accuracy to 25um (cpk ≥1.0)

The evolutionary Panasonic NPM-D3 continues in the steps of its award-winning predecessor with interchangeable dispensing, placement, and inspection heads; however, new enhancements further increase productivity. The NPM-D3 now handles a component range spanning 03015mm microchips to massive 100x90mm components up to 28mm tall, as well as Package on Package applications.

5. Heller 1936 MKV SMT Reflow Oven.

This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases).

Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow

Excellent results demonstrated for wafer bumping application in horizontal reflow oven

Fluxless reflow utilizes gas phase Formic Acid (HCOOH) to replace standard fluxing agents

Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps

No post-reflow flux clean facilitates inline application of epoxy and inline epoxy curing solution

Feasibility has been demonstrated with production grade oven

Extensive engineering efforts in safe, precision delivery of formic acid and abatement

6. Koh Young ZENITH Alpha 3D AOI

1: Advanced Hardware FeaturesThe World's Best-selling & First Full 3D Automated Optical Inspection Eliminates all the sources of defects using full 3D measuring inspection equipment skills- Removes shadow problems utilizing 8-way projection- Realizes perfect 3D solder joint inspection- Provides accurate inspection data with real-time PCB warp compensation· Full 3D data-based process optimization solution: Realization of industry 4.0 smart factory- Process information DB and real-time remote monitoring- Inspection program management automation & efficiency· Optimized specification model for a variety of production environment
High-precision weld seam measurement algorithm provided by KOH YOUNG technology for artificial intelligence

7. SMT PCB NG/OK Unloader

1.PLC+Touch screen control , easy to operate.

2.Design with firm structure.

3.The upper and lower air clamps ensure the location of the material box accurately.

4.Special gas path design ensures that the PCB panel is not pushed.

5.Automatic detection of fault code display function.

6.With SMEMA signal.

Keywords:

SMT Assembly line, PCB Assembly line, JUKI SMT Assembly Line, Samsung SMT Assembly Line, Hanwha SMT Assembly Line, Panasonic SMT Assembly Line, FUJI SMT Assembly Line, Yamaha SMT Assembly Line.