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Koh Young KY8080 3D SPI
Specifications:
The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste.
• True patented 3D volume measurement
• No false calls – no escapes – no shadow problems
• Highest accuracy and repeatability
• No PCB color sensitivity
• Solder paste printing optimization - at its best
• Lower initial investment
• Low cost of ownership, fast ROI
• Shortest programming time
• Accurate, powerful SPC tool package
In-line SPI with no compromises KY-8030 is designed for manufacturers who need in-line SPI with no compromises in high precision and accuracy. With KY-8030, you buy the throughput capability that you need
KY-8030 is a process optimization tool built with world-class Koh Young quality components and engineering. It’s the perfect complement to your manufacturing line, where precise, accurate, repeatable results cannot be compromised. The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste. Superb Performance and Value in Automated 3D SPI
Medium-volume users will appreciate KY-8030’s rugged dependability and all the benefits of in-line 3D SPI but at a lower initial investment. It delivers superior value to the customer because it will out-perform costly competitive systems that don’t offer true 3D SPI.
Inspection Range
Metrology Capability
Volume, Area, Height, Offset, Bridging and Shape Deformity
Types of Defects
Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset
Measurement Principle
3D Shadow Free Moiré
Camera Technology
Camera
2MPix
XY Pixel Resolution: 20 µm 0.79 mils
Z Resolution: 0.37 µm 0.015 mils
Inspection Speed
at 20 um
Shadow Free Mode:15.0 cm2/sec 2.33 sq. inch/sec
High Speed Mode: 19.7 cm2/sec 3.05 sq. inch/sec
Volume Repeatability
< 1% at 3sigma (on a KY Calibration Target)
< 3% at 3sigma (on a PCB)
Height Accuracy
2mm
Gage R&R
< 10 % at 6Sigma (± 50 tolerance)
Max. PCB Warp
± 3.5 mm
Max. Paste Height
400um 15.75 mils
Min. Paste Deposit Size at 20um
Rectangle: 150um 5.91 mils
Circle Min: 200um 7.87 mils
Distance between Paste Deposit
100 mm (at 150 mm paste height) 3.94 mils (at 5.91 mils paste height)
PCB Handling
Conveyor Width Adjustment
Automatic
Conveyor Fix Type
Front/Rear Fixed (Factory Setting)
Conveyor Height
970 ~ 870 mm 38.19 ~ 34.25 inch
System & Installation requirements
Supply
Electrical 200 ~ 240VAC, 50/60 Hz Single phase
Air: 5 Kgf/cm2
Operating System
Windows XP Professiona
S/W
Statistical Analysis Tool
SPC Plus
Inspection Program Generation
Import GERBER Data (274X, 274D)
Options
Zoom Head (15, 20, 30 mm Autozoom)
Off-line SPC & Defect Review Station
Off-line Programming Station ODB++ File Conversion
Barcode Reader (1D/2D) HDD Raid 1 (Mirrored)
Certified Calibration Target UPS
Above specifications are subject to change whithout notice.
SMT AOI MachineI, PCB quality inspection AOI, China AOI Machine, AOI manufacturer, SMT SPI manufacturer, SMT AOI supplier.
Contact: Mr Tommy
Phone: +86 13691605420
Tel: +86 -755-85225569
Email: tommy@flason-smt.com
Add: 94#,Guangtian Road,Songgang Street,Bao an District Shenzhen China