JUKI KE-2030 chip mounter

Description:

JUKI KE-2030 chip mounter

JUKI 2030 is 20000CPH can achieve high-speed performance "double-chip high-speed placement machine."
Not only can be used around 2 patch head to mount two substrates at the same time,

but also to achieve the same type of mounting the highest efficiency,

Specifications
Vintage:2004
Placement:20,000cph
2 multi nozzle laser heads(8 nozzles)
From: 0603 (0201)chip to 26.5 x 11mm chip or 20mm square chip
Simultaneous placement of components onto two boards
Medium board size: 330 x 250mm
Large board size: 410 x 360mm
Extra large board size: 510 x 460mm
Applicable component height: 6mm, 12-20mm
Component size: 25mm, 0603 chip, from 1005 chip
to 20mm square chip or 26.5 x 11mm chip.
From 1005 chip to 50mm square chip or 50 x 150mm chip
Component placement speed: chip, IC: 20,000cph
Component placement accuracy: Laser recognition +/- 0.08mm
Vision Recognition
Max. unique components: 120 per side using 8mm tape feeders
Feeders type available: tape- 8mm, 12mm, 16mm, 24mm, 32mm, 44mm, and 56mm.
Stick/ bulk/ tray not available
Power: 3 phase 200/220/240 or 380 VAC
Compressed Air: 71psi
Operating System: Windows NT
Programming Methods: On line: teach with placement head, teach camera, key board only
Off Line: keyboard entry, CAD data conversion with optional software
Program Size: Maximum 3000 placements per circuit, not to exceed 10,000
Maximum 100 non-matrix or 400 matrix circuits per PCB.
Data entry resolution: X/Y axis 0.0004” (o.01mm)
Teta axis (rotation) 0.05

Entry in millimeters or inches
Self Calibration: Self calibration routine allows operator
to recalibrate at anytime in just minutes
Up and Down line connection: SMEMA standard
Teach Camera: Allows teaching of pick and placement location with
one of two CCD cameras mounted on the head assembly
Auto Tool Changer: The two tool changer hold up to fourty-one (41) vacuum nozzle
Seventeen (17) vacuum nozzles are standard (8x502, 8x504, 1x508)
Placement Heads: Two (2) Multi- Nozzles Laser Align (MNLA) high speed assembley
head (total of 8 nozzles) driven by a overhead X/Y gantry positioning
System with closed loop twin AC servo motors and magnetic linear encoders
Component Pick and Placement Method: Pickup and placement is
performated via vacuum nozzle with programmable pick and placement force
Component Centering: Non Contact TouchLess Centering (TLC) using LaserAlign Sensor
Component Detection: Vacuum Sensor and Laser

Keywords:

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