Automatically adjust the component recognition sensor of the mounter head from 1 to 25 mm in 5 stages according to the PCB requirements. High productivity is achieved without replacing the placement head, even for parts with different heights, from very small parts to large parts.
High placement capacity of 40,000 CPH
The distance between the pickup and placement positions is shortened by adopting the new SMT Pick and Place Machine RF series electric feeder.
Extensive component compatibility
Components from 0.2 mm × 0.1 mm to 74 mm square, 50 mm × 150 mm, and the height of parts up to 25 mm can be mounted. Component range and placement speed have been improved by changing the image recognition to four-part simultaneous recognition and using high-speed motors on the ? (theta) axis of the nozzle. In addition, we adopted a new electric feeder that is smaller, lighter, and thinner. The feeder capacity has been increased to 112 per RS-1 to improve capability of a single machine solution.
Implementation of smart mounting process