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3D In line Solder Paste Inspection Machine InSPIre-510
Specifications:
3D In line Solder Paste Inspection Machine
TECHNICAL PARAMETERS:
Inspection Principle: Sine white projection PMP inspection
Inspection type:Volume, area, height, XY offset, shape, etc.
Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.
Smallest component size:01005.
Accuracy: XY=10 um,Height = 0.37 um.
Repeatability: height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma).
Maximum Loading PCB Size(X*Y):510x505mm.
Inspection Speed: 0.35 SEC/FOV.
Fiducial Detection Time: 0.3sec/piece.
Maximum inspection height:±450um (±1200umOption).
High precision industrial camera with high frame count.
RGB Tune patented technology.
D-lighting patented technology.
Dynamic and static warpage compensation.
Barcode function with traceability.
Badmark transfer function to mounters.
Access IMS system functions.
Operating System Support: Windows 7 Professional (64 bit).
Five-minute programming, one-click operation.
SPC process control.
Keywords:
SMT AOI Machine, Offline AOI Machine, Inline AOI Machine, SMT X Ray Machine, SMT SPI Machine, 3D SPI Machine, 3D AOI Machine.
Contact: Mr Tommy
Phone: +86 13691605420
Tel: +86 -755-85225569
Email: tommy@flason-smt.com
Add: 94#,Guangtian Road,Songgang Street,Bao an District Shenzhen China