Introduction of SMD Reflow Oven:

SMD Reflow Oven

SMD reflow oven is mainly for used to soldering the SMD on PCB, normally the lead free process use SnAgCu solder paste to solder the SMD on the PCB. As the polulation of SMD on PCB is more and more big, and PCB pad become more and more small, so it required better solder paste like 4# solder paste for most PCB soldering. 5# and 6# solder paste used for chips soldering. Fro SMD reflow ovens, it also need long heating zones SMD reflow oven for got a better and easy controllable solder process. Nowadays, 8 heating zones and 10 heating zones SMT reflow ovens become the most polular reflow ovens in SMT assembly line.

Characters:

1. Well-known brand computer with Siemens PLC intelligent control system, high precision temperature control in ± 1-2 °C (if the computer has gone failure accidentally, it can realize off-line mode and not affecting production) and to ensure that the control system is stable and reliable;

2. Windows XP operating platform with user friendly operation.

3. In order to ensure safety and reliability, hood opening in automatically.

4. Device is equipped with mesh belt, transport smoothly, no shaking and no deformation, which ensure smooth PCB transport. Synchronous guide transmission mechanism and SMEMA connection ensure that guide adjustable wide precision and high service life.

5. Automatic controlled chain lubrication system..

6. PID closed loop control for all heating zones independently, sequential start up to reduce power consumption)

7. Mesh/chain transmission controlled by computer, which can fulfil different kinds of PCB production criteria.

8. Visual & Audio Alarm for abnormal condition.

9. With leakage protector, ensure safety protection for operating personnel and control system.

10. The built-in UPS and automatic delay shutdown system guarantee power failure or overheat won’t harm the PCB and machine.

11. The German ERSA world leading tiny circulation heating mode, and the upper and lower independent air tiny circulation system, temperature uniformity and thermal compensation high efficiency, high efficient supercharged accelerated air duct, greatly improve the circulating hot air flow, heat up temperature quickly (about twenty minutes), thermal compensation for high efficiency, high temperature welding and curing;

12. The upper and lower every temperature zone with independent temperature inductive sensor, real-time monitoring and compensation every temperature zone balance;

13. Have password administration of the operating system, to prevent the irrelevant personnel changes to the process parameters, operation records management traceability process parameters modification, improve the management convenient. Capable for saving user existing parameters and profile printout;

14. Integrated control window, the computer switch, test or printout profile and data transmission are convenient, humanized design. Equipped with three-channel temperature profiling system, may at any time to check soldering objects by the actual temperature profile (without 3^rd party profiler);

15. From international standard quick cooling system, magnifying glass type efficient rapid cooling, cooling speed can reach 3.5 ~ 6 °C/ SEC, management is very convenient; External chiller unit, ensure that spot crystal effect (Option selected items, the standard configuration for forced natural air cooling).

Specification:

Keywords:

SMT Reflow Oven, Nitrogen Reflow Oven, Dual Lane Reflow Oven, Vertical Reflow Oven, Vacuum SMT Reflow Oven, Lead free SMT Reflow Oven, Reflow Oven Manufacturer, LED Reflow Oven, China Reflow Oven.