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Solder paste should be allowed to reach room temperature (19-25°C (66-77°F)) without forced heating before use for a recommend time of between 6-8 hours, depending on packaging size. Once in use the solder paste should be used within 2 weeks - Exceeding 2 weeks of room temperature storage will compromise the performance of the solder paste during printing.
Within the solder paste printing machine the best practice is to maintain the environment inside the printer between 22°C – 29°C and 40% - 60% RH (refer to technical data of solder paste selected). It may be required for the printing machine to be fitted with a temperature and humidity control unit depending on the ambient temperature and humidity within the place of use.
Solder paste should ideally be dispensed using an applicator gun to produce a even bead on the stencil of approximately 12mm (1/2") in diameter and should cover the length of the PCB. The solder paste should be replenished if the bead is <12 mm (1/2”) and replaced when the stencil life has been exceeded or has been exposed to high temperatures inside the printer >29°C (84°F).
Generally solder paste has a stencil life of up to 24 hours but this can vary between different manufacturers - refer to datasheet. In most cases the stencil life isn't a problem as fresh solder paste is regularly being added and kneaded with the movement of the squeegees.
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