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Type 3 solder paste is generally considered to be the industry standard that will work for most printing applications. The use of Type 4 is really only needed for particularly fine-feature printing, where the Type 4 will produce better release and a more consistent volume deposit.
The point at which Type 4 solder paste should be considered over Type 3 solder paste in printing applications is generally in the range of a 9-mil stencil aperture width for most pastes, although other variables such as paste chemistry, stencil thickness and other printer parameters can have an impact. This means that Type 3 paste will generally work well down to an aperture with an opening of 9 mils or greater. For apertures that are narrower than 9 mils in width, the user is best off using Type 4 paste to assure consistent release from the stencil.
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